- Maximum designed layers：32 layers
- Maximum PIN count：46262
- Maximum Connections：33126
- Minimum line width：3 MIL
- Minimum line spacing：3.5 MIL
- Minimum via：8 MIL(4 MIL laser hole)
- Maximum board thickness：7 mm
- Maximum copper thickness：7 MIL
- Maximum BGA symbols count in one board：52
- Minimum BGA PIN pitch：0.5mm
- Highest speed signal：10G CML differential signals
- The quickest time limit：8 days for placement , SI and routing for 30000 pins PCB
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- Data Communication series：Routers、Network Switchs、Hardward Firewall、Access Sever、Etc.
- Transmission equipment：Optical transmitters and receivers、SDH、DWDM、METRO equipment、Etc.
- Multimedia Products：Visual telephone、Video Conference equipment、Etc.
- Wireless Products：PAS、GSM/GPRS、CDMA、WCDMA、3G equipment、wireless base station、Etc.
- Computer Products：Main board、Server main board and various industry control board and cards、Etc.
- Consumer Products：various mobile phone、Digital Camera、various videos and audio equipment、Etc.
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- Marvell Network Processing Chipset
- INTEL Main Chipset and Bridge Chipset
- AMD Main Chipset and Bridge Chipset
- Broadcom NetworkProcessing Chipset
- Broadcom Data Communication Chipset
- Broadcom Data Transfer Chipset
- Raza Multi-Core Network Processing Chipset
- Freescale/NXP PowerPC Chipset
- Philps Consumable Products Chipset
- VIA Main Chipset and Bridge Chipset
- ARM Chipset
- Qualcomm Chipset
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English
Designed Parameters
Technical Strength